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Precision Wafering Systems
Applied's Precision Wafering Systems division (formerly HCT Shaping Systems), based in Switzerland, is a solar industry pioneer and a world leader in wire saw technology. Since 1984, PWS has introduced many of the solar industry's key advances in wire sawing technology.

PWS' Wire saw technology from PWS improves silicon utilization, and cuts cost, by slicing silicon ingots or cast silicon into wafers less than 100 microns thick (about the thickness of a human hair), while simultaneously reducing kerf loss.

Wafering systems from PWS are known for their high mechanical accuracy and load capacity, as well as high uptime (>97%), minimal maintenance and low consumables cost. Cropper and squarer systems from PWS provide silicon savings of up to 10 metric tons per year with a kerf loss of only one-fifth that of band saws.

Location
Applied Materials Switzerland SA
Route de Genève 42
1033 Cheseaux
Switzerland
Tel: 41 21 731 9100
Fax: 41 21 731 9101

Applied HCT MaxEdge Applied HCT MaxEdge
Wire saw for ultra-thin wafering with unique dual wire management
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Applied HCT Squarer Applied HCT Squarer
System for slicing silicon ingots into bricks
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Applied HCT Cropper

Applied HCT Cropper
System for cropping the tops and tails of silicon ingots
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Applied HCT Slurry Recovery Unit (SRU) Applied HCT Slurry Recovery Unit (SRU)
Slurry recovery unit for slurry abrasive and coolant
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